Manufacturing Capability

Production Capacity

20 million pieces/day
Min. pitch of IC

0.4mm
Pitch of BGA Ball

0.35mm (Min.), 3.0mm (Max.)
Diameter of BGA Ball

0.20mm (Min.), 1.0mm (Max.)
Size of Max. Printed Circuit Board

1000mm(L) x 560mm (W) x 4.0mm (T)
Size of Min. Printed Circuit Board

50mm(L) x 50mm (W) x 0.4mm (T)
Size of Min. Chip Component

01005 (01005：0.4mm x 0.2mm), mass production is available.
Size of Max. Chip Component

Rectangle (50㎜×150㎜) Square (74㎜×74㎜)
Min. Space between two parts

0.2mm